The latest in Flip-Chip COB LED technology will be showcased by Daktronics during InfoComm 2024 in Las Vegas.

“We’re extremely excited to unveil our Flip-Chip COB product at InfoComm this year in Las Vegas,” said Jim Vasgaard, Daktronics national sales manager for the AV sales channel. “Its cabinets are the thinnest in the industry and the specific encapsulant we have engineered for this series brings a rich black contrast for superior image quality and a protective barrier with enhanced LED reliability. It eliminates LED damage during shipping and installation to ensure our display system provides a flawless first-time fire-up for our customers.”

In Booth W2617, Daktronics will display its 0.9-millimeter pixel pitch COB product by creating a 7-ft.-high by 12-ft.-wide 4K screen on one side of the booth and two 0.9-millimeter COB displays on the other side of the booth—one with high frame rate and the other pure black contrast. The company’s latest Integrated Matrix Device (IMD) LED technology will also be in the booth, including a 1.2mm floor display and a 0.7mm display with a 110-in. diagonal size. A speed frame mounting demo rounds everything that can be seen at the Daktronics booth.

The line of products Daktronics offers with this COB technology ranges from 1.8mm down to 0.9mm; it brings less heat to the display face and removes the wire bonds to increase reliability and also decreases the power consumption for a lower cost of ownership over time.

“Our COB product extends our Narrow Pixel Pitch (NPP) product lines that include Surface Mount Device (SMD) and IMD offerings,” concluded Adam Gilliland, Daktronics product manager. “This allows us the flexibility to deliver whichever product best fits the needs of the AV integrator and our customers. We’re looking forward to sharing these options with the industry and everyone who visits our booth at InfoComm.”

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